|
|
Technical Program Committee Members
Executive Committee Yih-Feng Chyan, Broadcom, General Chair
Marise Bafleur, LAAS/CNRS, Technical Program Chair
Frank Thiel, Legerity, Technical Program Vice-Chair, Awards
John Long, TU Delft, Past General Chair
Mourad El-Gamal, McGill University, Publications/Website Chair
Jan Jopke, CCS Events, Conference Manager
Bruce Hecht, Analog Devices, Local Arrangements Chair
Vida Ilderem, Motorola, Finance Chair
Donald Lie, DRC/UCSD, Short-Course Chair
Sorin Voinigescu, University of Toronto, Short-Course Vice-Chair
Dan Friedman, IBM, JSSC Guest Editor (2005)
Hugo Veenstra, NXP Semiconductor, JSSC Guest Editor (2006)
Marcel Tutt, Freescale Semiconductor, Publicity chair
David Ngo, RFMD, Publicity co-chair, Emerging Technologies Chair
Hugo Veenstra, Philips, Analog/Digital (Chair)
John Cressler, Georgia Tech, Device Physics (Chair)
Laurence Nagel, Omega Enterprises, Modeling/Simulation (Chair)
Saurabh Desai, National Semiconductor, Power Devices (Chair)
Alvin Joseph, IBM, Process Technology (Chair)
Paul C. Davis, Consultant, RF (Chair) Analog Committee
Hugo Veenstra, NXP Semiconductor, Chair
Rob Fox, U of Florida Dan Friedman, IBM
Kevin Kornegay, Cornell University
Bruce Hecht, Analog Devices
Sorin Voinigescu, University of Toronto
Jim Haslett,University of Calgary
Herbert Knapp, Infineon Device Physics Committee
John Cressler, Georgia Inst. of Technology, Chair
Constantin Bulucea, National Semiconductor
Kyushik Hong,Samsung
Jae-Sung Rieh, Korea University
Nic Rinaldi, University of Naples
Lis Nanver, TU Delft
Jayasimha Prasad, Maxim
Rik Jos, NXP Modeling Committee
Laurence Nagel,Omega Enterprises, Chair
Joerg Berkner, Infineon Technologies
James Parker, Linear Technology
Dave Walkey, Carleton University
Thomas Zimmer, University Bordeaux 1
Wolfgang Kraus, Atmel Germany
David Sheridan, IBM
Doug Weiser, TI
Power Devices Committee
Saurabh Desai, National Semiconductor, Chair
Mohamed Darwish, Siliconix
Sameer Pendharkar, TI
Tom Krutsick, Legerity
Marie Breil, LAAS CNRS
Phil Mawby, University of Warwick
Gary Dolny, Fairchild Semiconductor
Akio Nakagawa,Toshiba
Process Technology Committee
Alvin Joseph, IBM, Chair
Pascal Chevalier, STMicroelectronics
Wibo van Noort, NXP Semiconductor
Dieter Knoll, IHP
Jim Kirchgessner, Freescale Semiconductor
Katsuya Oda, Hitachi
Rob Rassel, IBM
Koji Yonemura, Toshiba
RF Committee
Paul C. Davis, Consultant, Chair
Sven Mattisson, Ericsson Mobile Platforms
Donald Lie, DRC/UCSD
Francesco Svelto, U. Pavia
Jean-Baptiste Begueret, IXL Lab
Leon van den Oever, NXP Semiconductor |